The EP2C70F896C8 is a Field Programmable Gate Array (FPGA) from Intel, packaged in a 896-pin FBGA package, suitable for surface mount. It operates at a maximum frequency of 260MHz and a maximum supply voltage of 1.25V, with a minimum operating temperature of 0°C and a maximum operating temperature of 85°C. The device contains 68416 logic elements and 4276 logic blocks, with 622 I/Os and 1152000 bits of RAM.
Frequency402.58MHz
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EP2C70F896C8 technical specifications.
General
| Package/Case | FBGA |
| Frequency | 402.58MHz |
| Lead Free | Contains Lead |
| Max Frequency | 260MHz |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 1.25V |
| Memory Size | 1152000b |
| Min Operating Temperature | 0°C |
| Min Supply Voltage | 1.15V |
| Mount | Surface Mount |
| Number of I/Os | 622 |
| Number of Logic Blocks (LABs) | 4276 |
| Number of Logic Elements/Cells | 68416 |
| Package Quantity | 27 |
| Packaging | Tray |
| RAM Size | 1152000b |
| RoHS Compliant | No |
| Series | Cyclone® II |
Compliance
| RoHS | Not Compliant |
Datasheet
Intel EP2C70F896C8 Datasheet
Download the complete datasheet for Intel EP2C70F896C8 to view detailed technical specifications.
No datasheet is available for this part.
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