
Field Programmable Gate Array (FPGA) with 60,440 logic cells and 334 user I/Os, built on 90nm process technology. Features 2484.6 Kbit of RAM, 144 dedicated 18x18 multipliers, and 36 dedicated DSP blocks. Supports DDR SDRAM, DDR2 SDRAM, RLDRAM II, and QDRII+ SRAM external memory interfaces. Operates within a 0°C to 85°C temperature range. Packaged in a 484-pin FC-FBGA (Flip Chip Fine Pitch Ball Grid Array) for surface mounting.
Intel EP2S60F484C3NES technical specifications.
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