Field Programmable Gate Array (FPGA) with 24,624 logic cells and 594 Kbit RAM. Features 66 multipliers (18x18) and 66 Block RAMs, built on 65nm process technology. Supports up to 156 user I/Os with extensive differential and single-ended I/O standards including LVPECL, LVDS, LVTTL, and LVCMOS. External memory interfaces for DDR2 SDRAM and QDRII+ SRAM are available. Packaged in a 256-pin UBGA (14x14x0.95mm) for surface mounting, operating between 0°C and 85°C.
PackageUBGA
MountingSurface Mount
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Technical Specifications
Intel EP3C25U256C7ES technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
UBGA
Package Description
Ultra Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
0.95
Seated Plane Height (mm)
1.35
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-275JJAA-2
Family Name
Cyclone® III
Maximum Number of User I/Os
156
RAM Bits
594Kbit
Device Logic Cells
24624
Process Technology
65nm
Number of Multipliers
66 (18x18)
Programmability
No
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Speed Grade
7
Differential I/O Standards Supported
LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS
Single-Ended I/O Standards Supported
LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
External Memory Interface
DDR2 SDRAM|QDRII+SRAM
Device Number of DLLs/PLLs
4
Supported IP Core
Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC| 32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
Supported IP Core Manufacture
Altera/Freescale/CAST, Inc/MorethanIP/PLDA
Total Number of Block RAM
66
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel EP3C25U256C7ES Datasheet
Download the complete datasheet for Intel EP3C25U256C7ES to view detailed technical specifications.
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