Field-Programmable Gate Array (FPGA) with 150,848 logic cells and 5,994 Kbit RAM. Features a 65nm process technology and operates at 402MHz. This device offers 413 maximum user I/Os and supports DDR2 SDRAM and QDRII+ SRAM external memory interfaces. Packaged in a 780-pin FBGA (Fine Pitch Ball Grid Array) with a 1mm pin pitch, it is designed for surface mounting. Operating temperature range is 0°C to 85°C.
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Intel EP3CLS150F780C8ES technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 780 |
| PCB | 780 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 1.75 |
| Seated Plane Height (mm) | 2.25 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAM-1 |
| Family Name | Cyclone® III LS |
| Maximum Number of User I/Os | 413 |
| RAM Bits | 5994Kbit |
| Device Logic Cells | 150848 |
| Process Technology | 65nm |
| Number of Multipliers | 320 (18x18) |
| Programmability | No |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Speed Grade | 8 |
| Differential I/O Standards Supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS |
| Single-Ended I/O Standards Supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| External Memory Interface | DDR2 SDRAM|QDRII+SRAM |
| Device Number of DLLs/PLLs | 4 |
| Supported IP Core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Public Key Crypto Engine (BA414E)| 32|64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz |
| Supported IP Core Manufacture | Altera/CAST, Inc/Barco Silex/PLDA |
| Total Number of Block RAM | 666 |
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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