
Field-Programmable Gate Array (FPGA) with 198,464 logic cells and 396 integrated 18x18 multipliers. Features 8019 Kbit of RAM and 413 maximum user I/Os, built on 65nm process technology. Operates at a maximum frequency of 437.5MHz and supports a wide range of differential and single-ended I/O standards, including DDR2 SDRAM and QDRII+ SRAM external memory interfaces. Packaged in a 780-pin FBGA (Fine Pitch Ball Grid Array) with a 1mm pin pitch, suitable for surface mounting. Operating temperature range is -40°C to 100°C.
Intel EP3CLS200F780I7ES technical specifications.
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