Field Programmable Gate Array (FPGA) with 70,208 logic cells and 2997 Kbit RAM. Features 65nm process technology and operates at 437.5MHz with a 1.2V supply. This surface-mount device utilizes a 780-pin FBGA package measuring 29x29mm with a 1mm pin pitch. Supports a maximum of 413 user I/Os and interfaces with DDR2 SDRAM and QDRII+ SRAM. Includes 200 18x18 multipliers and 4 DLLs/PLLs, operating between 0°C and 85°C.
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Intel EP3CLS70F780C7ES technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 780 |
| PCB | 780 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 1.75 |
| Seated Plane Height (mm) | 2.25 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAM-1 |
| Family Name | Cyclone® III LS |
| Maximum Number of User I/Os | 413 |
| RAM Bits | 2997Kbit |
| Device Logic Cells | 70208 |
| Process Technology | 65nm |
| Number of Multipliers | 200 (18x18) |
| Programmability | No |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Speed Grade | 7 |
| Differential I/O Standards Supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS |
| Single-Ended I/O Standards Supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| External Memory Interface | DDR2 SDRAM|QDRII+SRAM |
| Device Number of DLLs/PLLs | 4 |
| Supported IP Core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Public Key Crypto Engine (BA414E)| 32|64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz |
| Supported IP Core Manufacture | Altera/CAST, Inc/Barco Silex/PLDA |
| Total Number of Block RAM | 333 |
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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