Field Programmable Gate Array (FPGA) with 70,208 logic cells and 2997 Kbit of RAM. Features 200 multipliers (18x18) and a 65nm process technology. Supports up to 413 user I/Os and offers external memory interfaces for DDR2 SDRAM and QDRII+ SRAM. Packaged in a 780-pin FBGA (29x29mm) for surface mounting, operating across a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EP3CLS70F780I7N technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
780
PCB
780
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAM-1
Family Name
Cyclone® III LS
Maximum Number of User I/Os
413
RAM Bits
2997Kbit
Device Logic Cells
70208
Process Technology
65nm
Number of Multipliers
200 (18x18)
Programmability
No
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Speed Grade
7
Differential I/O Standards Supported
LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS
Single-Ended I/O Standards Supported
LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
External Memory Interface
DDR2 SDRAM|QDRII+SRAM
Device Number of DLLs/PLLs
4
Supported IP Core
Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Public Key Crypto Engine (BA414E)| 32|64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
Supported IP Core Manufacture
Altera/CAST, Inc/Barco Silex/PLDA
Total Number of Block RAM
333
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EP3CLS70F780I7N Datasheet
Download the complete datasheet for Intel EP3CLS70F780I7N to view detailed technical specifications.
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