Field-Programmable Gate Array (FPGA) featuring 49,888 logic cells and 2502 Kbit of RAM, built on 60nm process technology. This device offers 310 user I/Os, two Ethernet MACs, 140 multipliers (18x18), and eight transceiver blocks operating at 3.125 Gbps. It supports various I/O standards including LVTTL, LVCMOS, B-LVDS, HSTL, and LVPECL, with external memory interfaces for DDR2 SDRAM and QDRII+SRAM. The FPGA is housed in a 672-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27mm with a 1mm pin pitch, designed for surface mounting and operating within a temperature range of -40°C to 100°C.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Intel EP4CGX50DF27I8ES datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 672 |
| PCB | 672 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.75 |
| Seated Plane Height (mm) | 2.25 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Cyclone® IV GX |
| Maximum Number of User I/Os | 310 |
| RAM Bits | 2502Kbit |
| Device Logic Cells | 49888 |
| Process Technology | 60nm |
| Ethernet MACs | 2 |
| Number of Multipliers | 140 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.125Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| PCI Blocks | 1 |
| Speed Grade | 8 |
| Differential I/O Standards Supported | B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL |
| Single-Ended I/O Standards Supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| External Memory Interface | DDR2 SDRAM|QDRII+SRAM |
| Device Number of DLLs/PLLs | 4 |
| Supported IP Core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter |
| Supported IP Core Manufacture | Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc |
| Total Number of Block RAM | 278 |
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Intel EP4CGX50DF27I8ES to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
