Field Programmable Gate Array (FPGA) with 73,920 logic cells and 4,158 Kbit RAM. This device utilizes 60nm process technology and operates at 1.2V. It features 2 Ethernet MACs, 198 multipliers, and 8 transceiver blocks supporting 3.125 Gbps. The 484-pin FBGA package is designed for surface mounting and offers 290 user I/Os.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EP4CGX75DF23I6N technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
2.2(Max)
Seated Plane Height (mm)
2.6(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAJ-1
Family Name
Cyclone® IV GX
Maximum Number of User I/Os
290
RAM Bits
4158Kbit
Device Logic Cells
73920
Process Technology
60nm
Ethernet MACs
2
Number of Multipliers
198 (18x18)
Programmability
Yes
Transceiver Blocks
8
Transceiver Speed
3.125Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
PCI Blocks
1
Speed Grade
6
Differential I/O Standards Supported
B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL
Single-Ended I/O Standards Supported
LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
External Memory Interface
DDR2 SDRAM|QDRII+SRAM
Device Number of DLLs/PLLs
4
Supported IP Core
Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
Supported IP Core Manufacture
Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc
Total Number of Block RAM
462
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EP4CGX75DF23I6N Datasheet
Download the complete datasheet for Intel EP4CGX75DF23I6N to view detailed technical specifications.
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