EP4SE530F43C2NES

Field Programmable Gate Array (FPGA) with 531,200 logic cells and 424,960 registers, built on 40nm process technology. Features 1760 pins in a 42.5mm x 42.5mm Flip Chip Fine Pitch Ball Grid Array (FC-FBGA) package for surface mounting. Offers 960 user I/Os, 27,376 Kbit RAM, 1024 18x18 multipliers, 128 dedicated DSP blocks, and 112 SERDES channels supporting up to 11.3 Gbps transceiver speeds. Supports multiple external memory interfaces including DDR2/DDR3 SDRAM and RLDRAM II. Operates within a 0°C to 85°C temperature range.