
Field-Programmable Gate Array (FPGA) with 228,000 logic cells and 182,400 registers, built on 40nm process technology. Features 1152 pins in a 35mm x 35mm x 2.7mm Flip Chip Fine Pitch Ball Grid Array (FC-FBGA) package for surface mounting. Offers 560 user I/Os, 17.133 Mbits of RAM, 1288 18x18 multipliers, and 16 transceiver blocks operating at 8.5 Gbps. Supports multiple external memory interfaces including DDR2, DDR3, RLDRAM II, and QDRII+SRAM, with 161 dedicated DSP blocks and 2 PCI blocks. Operates within a temperature range of -40°C to 100°C.
Intel EP4SGX230FF35I4 technical specifications.
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