Complex Programmable Logic Device (CPLD) featuring 980 macro cells and 127 logic elements within a 0.18um process technology. This 144-pin FBGA package offers in-system programmability and operates at a maximum frequency of 304MHz. It supports dual supply voltages of 2.5V and 3.3V, with a minimum operating voltage of 2.375V. The device is designed for surface mounting and operates within a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM1270F144I3NES technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
144
PCB
144
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
1.8(Max)
Seated Plane Height (mm)
2.2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-192AAD-1
Family Name
MAX® II
Device Logic Cells
1270
Number of Logic Blocks/Elements
127
Number of Macro Cells
980
Program Memory Type
Flash
Process Technology
0.18um
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Typical Operating Supply Voltage
2.5|3.3V
Min Operating Supply Voltage
2.375V
Programmability
Yes
In-System Programmability
Yes
Speed Grade
3
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EPM1270F144I3NES Datasheet
Download the complete datasheet for Intel EPM1270F144I3NES to view detailed technical specifications.
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