144-pin FBGA Complex Programmable Logic Device (CPLD) featuring 980 macro cells and 1270 logic cells. This device operates at up to 304MHz using 0.18um process technology and a typical 1.8V supply voltage. It offers in-system programmability and is designed for surface mount applications with a 13mm x 13mm package.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM1270GF144C3NES technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 1.8(Max) |
| Seated Plane Height (mm) | 2.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-192AAD-1 |
| Family Name | MAX® II |
| Device Logic Cells | 1270 |
| Number of Logic Blocks/Elements | 127 |
| Number of Macro Cells | 980 |
| Program Memory Type | Flash |
| Process Technology | 0.18um |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 1.8V |
| Min Operating Supply Voltage | 1.71V |
| Programmability | Yes |
| In-System Programmability | Yes |
| Speed Grade | 3 |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Intel EPM1270GF144C3NES Datasheet
Download the complete datasheet for Intel EPM1270GF144C3NES to view detailed technical specifications.
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