Complex Programmable Logic Device (CPLD) featuring 1700 macro cells and 2210 device logic cells, built on 0.18um process technology. Operates with typical supply voltages of 2.5V or 3.3V, offering 272 user I/Os. Packaged in a 324-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm. This device supports in-system programmability and operates within a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM2210F324I4NES technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.25 |
| Seated Plane Height (mm) | 1.75 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAG-1 |
| Family Name | MAX® II |
| Device Logic Cells | 2210 |
| Number of User I/Os | 272 |
| Number of Logic Blocks/Elements | 221 |
| Number of Macro Cells | 1700 |
| Program Memory Type | Flash |
| Process Technology | 0.18um |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Min Operating Supply Voltage | 2.375V |
| Programmability | Yes |
| In-System Programmability | Yes |
| Speed Grade | 4 |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Intel EPM2210F324I4NES Datasheet
Download the complete datasheet for Intel EPM2210F324I4NES to view detailed technical specifications.
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