Complex Programmable Logic Device (CPLD) featuring 1700 Macro Cells and 2210 Device Logic Cells. This surface-mount component utilizes 0.18um process technology and operates at a typical supply voltage of 1.8V, with a minimum of 1.71V. The 324-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 19mm x 19mm with a 1mm pin pitch, offers 272 user I/Os. Programmable and in-system programmable, this device supports a speed grade of 3 and operates within a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM2210GF324I3NES technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.25
Seated Plane Height (mm)
1.75
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAG-1
Family Name
MAX® II
Device Logic Cells
2210
Number of User I/Os
272
Number of Logic Blocks/Elements
221
Number of Macro Cells
1700
Program Memory Type
Flash
Process Technology
0.18um
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Typical Operating Supply Voltage
1.8V
Min Operating Supply Voltage
1.71V
Programmability
Yes
In-System Programmability
Yes
Speed Grade
3
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel EPM2210GF324I3NES Datasheet
Download the complete datasheet for Intel EPM2210GF324I3NES to view detailed technical specifications.
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