Complex Programmable Logic Device (CPLD) featuring 192 macrocells and 240 logic cells, built on 0.18um process technology. Operates with a typical supply voltage of 1.8V, offering in-system programmability. This 100-pin TFBGA package, with a 1mm pin pitch, is designed for surface mounting and supports 80 user I/Os. The device operates within a temperature range of 0°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM240GF100C3NES technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
100
PCB
100
Package Length (mm)
11
Package Width (mm)
11
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-192DAC-1
Family Name
MAX® II
Device Logic Cells
240
Number of User I/Os
80
Number of Logic Blocks/Elements
24
Number of Macro Cells
192
Program Memory Type
Flash
Process Technology
0.18um
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
1.8V
Min Operating Supply Voltage
1.71V
Programmability
Yes
In-System Programmability
Yes
Speed Grade
3
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel EPM240GF100C3NES Datasheet
Download the complete datasheet for Intel EPM240GF100C3NES to view detailed technical specifications.
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