Complex Programmable Logic Device (CPLD) featuring 440 macro cells and 570 device logic cells. This surface-mount component utilizes 0.18um process technology and operates with a typical supply voltage of 2.5V or 3.3V. It offers 160 user I/Os and is housed in a 256-pin Fine Pitch Ball Grid Array (FBGA) package measuring 17mm x 17mm x 1.25mm. The device supports in-system programmability and operates within a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM570F256I3NES technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.25
Seated Plane Height (mm)
1.75
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
MAX® II
Device Logic Cells
570
RAM Bits
0Kbit
Number of User I/Os
160
Number of Logic Blocks/Elements
57
Number of Macro Cells
440
Program Memory Type
Flash
Process Technology
0.18um
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Typical Operating Supply Voltage
2.5|3.3V
Min Operating Supply Voltage
2.375V
Programmability
Yes
In-System Programmability
Yes
Speed Grade
3
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EPM570F256I3NES Datasheet
Download the complete datasheet for Intel EPM570F256I3NES to view detailed technical specifications.
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