Complex Programmable Logic Device (CPLD) featuring 440 macro cells and 570 device logic cells. This surface-mount component utilizes 0.18um process technology and operates at a typical supply voltage of 1.8V, with a minimum of 1.71V. It offers 76 user I/Os and is housed in a 100-pin Thin Profile Fine Pitch Ball Grid Array (TFBGA) package with a 1mm pin pitch. Programmable and in-system programmable, this device supports a speed grade of 3 and operates within a temperature range of -40°C to 100°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Intel EPM570GF100I3NES technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
100
PCB
100
Package Length (mm)
11
Package Width (mm)
11
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-192DAC-1
Family Name
MAX® II
Device Logic Cells
570
RAM Bits
0Kbit
Number of User I/Os
76
Number of Logic Blocks/Elements
57
Number of Macro Cells
440
Program Memory Type
Flash
Process Technology
0.18um
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Typical Operating Supply Voltage
1.8V
Min Operating Supply Voltage
1.71V
Programmability
Yes
In-System Programmability
Yes
Speed Grade
3
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel EPM570GF100I3NES Datasheet
Download the complete datasheet for Intel EPM570GF100I3NES to view detailed technical specifications.
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