Complex Programmable Logic Device (CPLD) featuring 440 macro cells and 570 device logic cells. Operates at 201.1MHz with 0.18um process technology and a typical 1.8V supply voltage. Offers 160 user I/Os and in-system programmability. Housed in a 256-pin FBGA package measuring 17x17x1.25mm, suitable for surface mount applications.
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Intel EPM570GF256C5NES technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.25 |
| Seated Plane Height (mm) | 1.75 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAF-1 |
| Family Name | MAX® II |
| Device Logic Cells | 570 |
| RAM Bits | 0Kbit |
| Number of User I/Os | 160 |
| Number of Logic Blocks/Elements | 57 |
| Number of Macro Cells | 440 |
| Program Memory Type | Flash |
| Process Technology | 0.18um |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 1.8V |
| Min Operating Supply Voltage | 1.71V |
| Programmability | Yes |
| In-System Programmability | Yes |
| Speed Grade | 5 |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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