Complex Programmable Logic Device (CPLD) from the MAX® II family, featuring 440 macro cells and 57 logic elements. This device offers 116 user I/Os and is built on 0.18um process technology, operating at 2.5V/3.3V. Packaged in a 144-pin TQFP (Thin Quad Flat Package) with gull-wing leads for surface mounting, it supports in-system programmability and operates within a temperature range of 0°C to 85°C.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Intel EPM570T144C3NES technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
144
PCB
144
Package Length (mm)
20
Package Width (mm)
20
Package Height (mm)
1.4
Seated Plane Height (mm)
1.5
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFB
Family Name
MAX® II
Device Logic Cells
570
RAM Bits
0Kbit
Number of User I/Os
116
Number of Logic Blocks/Elements
57
Number of Macro Cells
440
Program Memory Type
Flash
Process Technology
0.18um
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
2.5|3.3V
Min Operating Supply Voltage
2.375V
Programmability
Yes
In-System Programmability
Yes
Speed Grade
3
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EPM570T144C3NES Datasheet
Download the complete datasheet for Intel EPM570T144C3NES to view detailed technical specifications.
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