64-bit microprocessor featuring a 3.16GHz clock speed and 45nm process technology. This Flip-Chip Land Grid Array (FCLGA) package offers 771 pins on a 771-pin PCB, with a surface mount configuration. It boasts a 4-core Xeon device core, 32KB instruction cache, and 32KB data cache. Operating supply voltage ranges from 1.155V to 1.605V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel EU80574KJ087N SLANP technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
771
PCB
771
Package Length (mm)
37.55(Max)
Package Width (mm)
37.55(Max)
Package Height (mm)
4.32(Max)
Seated Plane Height (mm)
4.32(Max)
Pin Pitch (mm)
1.09|1.17
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor X5460
Data Bus Width
64bit
Device Core
Xeon
Maximum Speed
3160MHz
Process Technology
45nm
Number of CPU Cores
4
Interface Type
PECI
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.155|1.35|1.605V
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EU80574KJ087N SLANP Datasheet
Download the complete datasheet for Intel EU80574KJ087N SLANP to view detailed technical specifications.
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