64-bit, 45nm microprocessor featuring a 3.2GHz clock speed and 4 CPU cores. This Flip-Chip Land Grid Array (FCLGA) package offers a 771-pin surface mount configuration with a 37.55mm maximum package dimension. Key technical specifications include 32KB instruction and data cache, and a maximum operating supply voltage range of 1.155V to 1.605V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel EU80574KL088N SLANZ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
771
PCB
771
Package Length (mm)
37.55(Max)
Package Width (mm)
37.55(Max)
Package Height (mm)
4.32(Max)
Seated Plane Height (mm)
4.32(Max)
Pin Pitch (mm)
1.09|1.17
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor X5482
Data Bus Width
64bit
Device Core
Xeon
Maximum Speed
3200MHz
Process Technology
45nm
Number of CPU Cores
4
Interface Type
PECI
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.155|1.35|1.605V
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel EU80574KL088N SLANZ Datasheet
Download the complete datasheet for Intel EU80574KL088N SLANZ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.