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Technical Specifications
Intel JL82575EB SLJBT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 576 |
| PCB | 576 |
| Package Length (mm) | 25 |
| Package Width (mm) | 25 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Physical Network Type | 1000BASE-LX|1000BASE-SX|1000BASE-T|100BASE-TX|10BASE-T |
| Category | Single Chip |
| Ethernet Speed | 10|100|1000Mbps |
| Host Interface | PCIe |
| Auto-Negotiation | Yes |
| Standard Supported | IEEE 802.1q|IEEE 802.3 |
| DMA Support | Yes |
| Communication Mode | Full Duplex|Half Duplex |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Loopback Mode | Internal |
| Maximum Power Dissipation | 2.4(Typ)W |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Intel JL82575EB SLJBT Datasheet
Download the complete datasheet for Intel JL82575EB SLJBT to view detailed technical specifications.
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