The PEB 2070-P is a 24-pin DIP through hole interface IC from Intel. It operates within a temperature range of 0°C to 70°C and has a typical supply voltage of 5V. The device supports HDLC and LAPD protocols and has a data rate of 2048. It is packaged in a plastic dual in line package with a pin pitch of 2.54mm and a height of 3.3mm.
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| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 31.75 |
| Package Width (mm) | 6.35 |
| Package Height (mm) | 3.3 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001AF |
| Data Rate | 2048Kbps |
| Reference Point Interface | S/T/U |
| Protocols Supported | HDLC|LAPD |
| Min Operating Supply Voltage | 4.75V |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Typical Operating Supply Voltage | 5V |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Intel PEB 2070-P to view detailed technical specifications.
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