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Technical Specifications
Intel PEB 20954 E technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LFBGA |
| Package Description | Low Profile Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 160 |
| PCB | 160 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 1.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Maximum Number of Channels | 32 |
| Tone Detection | Yes |
| Disabling Tones | G.164|G.165 |
| Category | Chip |
| Echo Return Loss | 30dB |
| Min Operating Supply Voltage | 3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Standard Supported | G.131|G.165|G.168|G.704|G.711 |
| Typical Operating Supply Voltage | 3.3V |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PEB 20954 E Datasheet
Download the complete datasheet for Intel PEB 20954 E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.