The PEB 2256 E is an 80-pin metric quad flat package lead-frame SMT surface mount IC with a gull-wing lead shape. It measures 14mm in length and width, and 2mm in height, with a seated plane height of up to 2.4mm. The IC has a pin pitch of 0.65mm and is made of plastic. It is designed for surface mount applications and conforms to the MO-108BE-1 Jedec standard.
PackageMQFP
MountingSurface Mount
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Technical Specifications
Intel PEB 2256 E technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | MQFP |
| Package Description | Metric Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 80 |
| PCB | 80 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 2 |
| Seated Plane Height (mm) | 2.4(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-108BE-1 |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Intel PEB 2256 E Datasheet
Download the complete datasheet for Intel PEB 2256 E to view detailed technical specifications.
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