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Intel PEB 3456 E technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 388 |
| PCB | 388 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.66 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Standard Framing Format | DS2|DS3|E1|M12|M13|M23|T1|T3 |
| Maximum Data Rate | 2.048Mbps |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Power Supply Type | Analog |
| Min Operating Supply Voltage | 2.25|3V |
| Max Operating Supply Voltage | 2.75|3.6V |
| Maximum Supply Current | 200|400mA |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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