This Intel Ball Grid Array IC is a specialized telecom IC with a maximum data rate of 90Mbps and a typical supply current of 200(Max) or 350(Max). It operates within a temperature range of 0 to 70°C and is designed for surface mount applications. The IC has a maximum operating supply voltage of 2.75V or 3.6V and a minimum operating supply voltage of 2.25V or 3V. It is a plastic ball grid array package with a seated plane height of 2.54(Max) mm and a pin pitch of 1.27 mm.
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Intel PEB20256EV21GXP technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 388 |
| PCB | 388 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.84(Max) |
| Seated Plane Height (mm) | 2.54(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Multichannel Network Interface Controller |
| Maximum Data Rate | 90Mbps |
| Max Operating Supply Voltage | 2.75|3.6V |
| Min Operating Supply Voltage | 2.25|3V |
| Power Supply Type | Analog |
| Typical Supply Current | 200(Max)|350(Max)mA |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Cage Code | 4BA62 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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