2-channel interface IC for specialized applications, featuring a 64-pin TQFP package with 0.5mm pin pitch. Offers 53dB longitudinal balance and includes on-chip ring relay driver and on-hook transmission capabilities. Operates from a 3.135V to 3.465V supply, with a typical supply current of 70mA. Designed for surface mounting with a plastic, lead-frame SMT package measuring 10x10x1.4mm.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Intel PEB3264F-V14 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BCD
Number of Channels per Chip
2
On-Chip Ring Relay Driver
Yes
On-Hook Transmission
Yes
Longitudinal Balanced
53(Min)dB
Polarity Reversal
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
3.465V
Min Operating Supply Voltage
3.135V
Typical Supply Current
70mA
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
5A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEB3264F-V14 Datasheet
Download the complete datasheet for Intel PEB3264F-V14 to view detailed technical specifications.
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