2-channel SLIC interface IC, featuring 53dB longitudinal balance and on-hook transmission. This surface-mount component utilizes a 64-pin Metric Quad Flat Package (MQFP) with gull-wing leads and a 0.8mm pin pitch. Operating from a 3.3V supply, it supports polarity reversal and includes an on-chip ring relay driver. The plastic MQFP package measures 14x14x2mm, suitable for SMT assembly.
PackageMQFP
MountingSurface Mount
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Technical Specifications
Intel PEB3264HV14XP technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
MQFP
Package Description
Metric Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
2
Seated Plane Height (mm)
2.45(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-112BC-2
Number of Channels per Chip
2
On-Chip Ring Relay Driver
Yes
On-Hook Transmission
Yes
Longitudinal Balanced
53(Min)dB
Polarity Reversal
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
3.465V
Min Operating Supply Voltage
3.135V
Typical Supply Current
70mA
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEB3264HV14XP Datasheet
Download the complete datasheet for Intel PEB3264HV14XP to view detailed technical specifications.
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