2-channel SLIC interface IC, featuring 60dB longitudinal balance and polarity reversal. This surface-mount device is housed in a 64-pin TQFP (Thin Quad Flat Package) with gull-wing leads, measuring 10x10x1.4mm with a 0.5mm pin pitch. Operating from a 3.135V to 3.465V supply, it includes an on-chip ring relay driver and on-hook transmission, with a typical supply current of 70mA. Designed for lead-frame SMT mounting, it operates within a temperature range of -40°C to 85°C.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Intel PEB3265FV15XP technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BCD
Number of Channels per Chip
2
On-Chip Ring Relay Driver
Yes
On-Hook Transmission
Yes
Longitudinal Balanced
60(Min)dB
Polarity Reversal
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
3.465V
Min Operating Supply Voltage
3.135V
Typical Supply Current
70mA
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEB3265FV15XP Datasheet
Download the complete datasheet for Intel PEB3265FV15XP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.