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Technical Specifications
Intel PEF 22827 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
1.5
Package Material
Plastic
Mounting
Surface Mount
Main Category
Chipset
Maximum Data Rate Range
>=1Mbps
Power Supply Type
Analog|Digital
Min Operating Supply Voltage
1.71|3.14V
Max Operating Supply Voltage
1.89|3.46V
Typical Supply Current
265mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Modulation Technique
BPSK|QAM
Typical Operating Supply Voltage
1.8|3.3V
Maximum Data Rate
70Mbps
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEF 22827 Datasheet
Download the complete datasheet for Intel PEF 22827 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.