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Intel PEF 22827 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LFBGA |
| Package Description | Low Profile Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 225 |
| PCB | 225 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 1.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Main Category | Chipset |
| Maximum Data Rate Range | >=1Mbps |
| Power Supply Type | Analog|Digital |
| Min Operating Supply Voltage | 1.71|3.14V |
| Max Operating Supply Voltage | 1.89|3.46V |
| Typical Supply Current | 265mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Modulation Technique | BPSK|QAM |
| Typical Operating Supply Voltage | 1.8|3.3V |
| Maximum Data Rate | 70Mbps |
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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