The Intel PEF 3304 E is a specialized IC in a 176-pin Low-Profile Ball Grid Array (LBGA) package. It has a seated plane height of 1.5mm maximum and a pin pitch of 1mm. The package is made of plastic and is designed for surface mount applications. The IC is suitable for use in a variety of telecom applications.
PackageLBGA
MountingSurface Mount
Quick Jump:
Chat with Datasheet
Sponsored by
Sign in to ask questions about the Intel PEF 3304 E datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Technical Specifications
Intel PEF 3304 E technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 176 |
| PCB | 176 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.5(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PEF 3304 E Datasheet
Download the complete datasheet for Intel PEF 3304 E to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.