The PEF22508EV11GXT is a surface-mounted Ball Grid Array (BGA) interface IC from Intel. It features a 256-pin count and a low-profile package with a maximum height of 1.5mm. The IC is designed for surface-mount applications and is packaged in a plastic LBGA case with a 1mm pin pitch. Operating temperature range is not specified.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Intel PEF22508EV11GXT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.5(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Intel PEF22508EV11GXT Datasheet
Download the complete datasheet for Intel PEF22508EV11GXT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.