This 160-pin Low Profile Ball Grid Array (LBGA) IC is a surface mount device with a plastic package and a seated plane height of 1.6mm. The package dimensions are 15mm in length and width, with a height of 0.3mm to 1.6mm. The IC features a ball grid array package type with a pin pitch of 1mm and a pin count of 160. It is suitable for use in surface mount applications.
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Intel PEF22554EV31GXP technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 160 |
| PCB | 160 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 1.6(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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