PackageLBGA
MountingSurface Mount
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Technical Specifications
Intel PEF22554EV31GXP technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
160
PCB
160
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
1.6(Max) - 0.3(Min)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel PEF22554EV31GXP Datasheet
Download the complete datasheet for Intel PEF22554EV31GXP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.