The PEF22622FV14XP is a surface mount quad flat package IC with 64 leads, packaged in a metric quad flat package with a gull-wing lead shape. It measures 14mm in length and width, and 2mm in height, with a seated plane height of 2.45mm maximum. The package material is plastic and has a pin pitch of 0.8mm. This IC is suitable for surface mount applications and is compliant with the MO-112BC-2 Jedec standard.
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Intel PEF22622FV14XP technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | MQFP |
| Package Description | Metric Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 2 |
| Seated Plane Height (mm) | 2.45(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-112BC-2 |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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