The PEF22622FV14XT is a surface mount IC packaged in a 14mm x 14mm x 2mm MQFP with 64 gull-wing leads. It is constructed from plastic and has a maximum seated plane height of 2.45mm. The IC is designed for use in lead-frame SMT applications and is compliant with the MO-112BC-2 Jedec standard.
Sign in to ask questions about the Intel PEF22622FV14XT datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Intel PEF22622FV14XT technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | MQFP |
| Package Description | Metric Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 2 |
| Seated Plane Height (mm) | 2.45(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-112BC-2 |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Intel PEF22622FV14XT to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
