The PEF3304ELV21NP is a 144-pin Ball Grid Array surface mount IC from Intel. It features a Low Profile Ball Grid Array package with a maximum height of 1.6mm and a seated plane height of 1.6mm. The package is made of plastic and has a pin count of 144. The IC is designed for surface mount applications and is suitable for use in a variety of electronic devices.
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Intel PEF3304ELV21NP technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 144 |
| PCB | 144 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 1.6(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.6(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 4BA62 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Intel PEF3304ELV21NP to view detailed technical specifications.
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