The PEF3304HLV21XP is a surface mount IC packaged in a 24mm x 24mm x 1.4mm LQFP with 176 gull-wing leads. It is designed for use in lead-frame SMT packages and is compliant with the MS-026BGA Jedec standard. The IC is suitable for use in a variety of applications, including those requiring a low profile quad flat package.
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Intel PEF3304HLV21XP technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 176 |
| PCB | 176 |
| Package Length (mm) | 24 |
| Package Width (mm) | 24 |
| Package Height (mm) | 1.4 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BGA |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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