The PEF3452HV13XP is a 44-pin lead-frame SMT quad flat package IC from Intel, featuring a metric quad flat package with a gull-wing lead shape and a seated plane height of 2.45mm. It is designed for surface mount applications and has a package material of plastic. The IC has a pin pitch of 0.8mm and is compliant with the Jedec MO-112AA-2 standard.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | MQFP |
| Package Description | Metric Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 44 |
| PCB | 44 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 2 |
| Seated Plane Height (mm) | 2.45(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-112AA-2 |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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