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Technical Specifications
Intel PSB21553EV14GXP technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.6(Max) - 0.3(Min)
Seated Plane Height (mm)
1.6(Max)
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
4BA62
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PSB21553EV14GXP Datasheet
Download the complete datasheet for Intel PSB21553EV14GXP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.