
Synchronous SRAM chip with 256Kb density, organized as 32K x 8 bits. Features a 25ns access time and operates at a maximum frequency of 20MHz. Interface supports SPI and serial 4-wire communication. Packaged in a lead-free TSSOP for surface mounting, with an operating voltage of 3.3V and an industrial temperature range of -40°C to 85°C.
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| Access Time | 25ns |
| Access Time-Max | 25ns |
| Address Bus Width | 1b |
| Package/Case | TSSOP |
| Density | 256Kb |
| Frequency | 20MHz |
| Height | 0.041inch |
| Interface | SPI, Serial, 4-WIRE |
| Lead Free | Lead Free |
| Length | 0.122inch |
| Max Frequency | 20MHz |
| Max Operating Temperature | 85°C |
| Memory Size | 256Kb |
| Memory Type | Volatile, , SRAM, SDR |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Number of Ports | 1 |
| Number of Words | 32000 |
| Operating Supply Voltage | 3.3V |
| Package Quantity | 100 |
| Packaging | Rail/Tube |
| Power | Yes |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Supply Current | 10mA |
| Supply Voltage-Nom | 3.6V |
| Sync/Async | Synchronous |
| Temperature Grade | INDUSTRIAL |
| Width | 0.177inch |
| Word Size | 8b |
| RoHS | Compliant |
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These are design resources that include the Microchip 23K256-I/ST
Microchip qualification plan for CuPdAu bond wire material in 8L TSSOP packages for various 23K and 23A series SRAM devices at the MMT assembly site.
