Qualification Plan for CuPdAu Bond Wire in Microchip 8L TSSOP Packages (PCN MFOL-04FAZG527)
Microchip qualification plan for CuPdAu bond wire material in 8L TSSOP packages for various 23K and 23A series SRAM devices at the MMT assembly site.
Overview
This document outlines the qualification plan (PCN MFOL-04FAZG527) for introducing palladium coated copper with gold flash (CuPdAu) as an additional bond wire material. The change affects specific Microchip 23K and 23A series SRAM catalog part numbers, including 23K640, 23K256, 23A256, and 23A640, in 8L TSSOP (4.4mm) packages assembled at the MMT site. The qualification includes reliability testing such as Wire Bond Pull, Wire Bond Shear, High Temperature Storage Life (HTSL), Preconditioning (MSL 1), Highly Accelerated Stress Test (HAST), Unbiased HAST (UHAST), and Temperature Cycling. Material specifications include C7025 lead-frame material, QMI519 die attach, and G600V molding compound.
Use Cases
- Reliability assessment of SRAM components
- Tracking material changes in semiconductor packaging
- Compliance verification for CuPdAu bond wire transition
Topics
Referenced Parts
Microchip
23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST catalog part numbers (CPN)
Microchip
23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256-E/ST catalog part numbers (CPN)
Microchip
23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST catalog part numbers (CPN)
Microchip
23K256T-E/ST, 23K640T-E/ST, 23K256-E/ST, 23K640-E/ST catalog part numbers (CPN)
Microchip
23K640-I/ST, 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST catalog part numbers (CPN)
Microchip
Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material 23K640T-I/ST
125C
Microchip
Electrical test pre and post stress at 85C and 125C
125C
Microchip
125C temp.
125C
Microchip
Electrical test pre and post stress at +25C, 85C and 125C
23A256T-
Microchip
I/ST, 23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T-
23K256-
Microchip
I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256-
23K640T-
Microchip
(CuPdAu) as an additional bond wire material 23K640T-
260C
Microchip
MSL 1 @ 260C
4.4mm
Microchip
numbers (CPN) available in 8L TSSOP (4.4mm) package at
4.4mm
Microchip
(CPN) available in 8L TSSOP (4.4mm) package at MMT assembly site.
85C
Microchip
Electrical test pre and post stress at 85C and 125C
85C
Microchip
Electrical test pre and post stress at +25C, 85C and 125C
85C
Microchip
Electrical test pre and post stress at +25C, 85C and
B100
Microchip
Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5
B108
Microchip
Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5
BD-004371-01
Microchip
BD Number BD-004371-01
C7025
Microchip
Material C7025
CDF-AEC-Q100-001
Microchip
Wire Bond Shear - WBS CDF-AEC-Q100-001 5 0 1 5 5 30 bonds from a min. 5 devices.
G600V
Microchip
MC Part Number G600V
JESD22
Microchip
Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5
JESD22-A103.
Microchip
JESD22-A103. +175 C for 504 hours or 150°C for 1008
JESD22-A104.
Microchip
Temp Cycle JESD22-A104. -65°C to +150°C for 500 cycles.
JESD22-A110.
Microchip
HAST JESD22-A110. +130°C/85% RH for 96 hours or
JESD22-A113.
Microchip
JESD22-A113. +150°C Bake for 24 hours, moisture
Jedec-STD-020E
Microchip
reflow temperature per Jedec-STD-020E for package
MFOL-04FAZG527
Microchip
PCN #: MFOL-04FAZG527
QMI519
Microchip
Die Attach Part Number QMI519
TK0017C5XD00
Microchip
MP Code (MPC) TK0017C5XD00
| 23A256-I/ST | Microchip | 23A256-I/ST, 23A640-I/ST catalog part numbers (CPN) available in 8L TSSOP |
| 23A256T-I/ST | Microchip | 23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST catalog part numbers (CPN) |
| 23A640-I/ST | Microchip | Part Number (CPN) 23A640-I/ST |
| 23A640T-I/ST | Microchip | 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256-E/ST catalog part numbers (CPN) |
| 23K256-E/ST | Microchip | 23K256-E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part numbers (CPN) |
| 23K256-I/ST | Microchip | 23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST catalog part numbers (CPN) |
| 23K256T-E/ST | Microchip | 23K256T-E/ST, 23K640T-E/ST, 23K256-E/ST, 23K640-E/ST catalog part numbers (CPN) |
| 23K256T-I/ST | Microchip | 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST catalog part numbers (CPN) |
| 23K640-E/ST | Microchip | 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part numbers (CPN) |
| 23K640-I/ST | Microchip | 23K640-I/ST, 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST catalog part numbers (CPN) |
| 23K640T-E/ST | Microchip | 23K640T-E/ST, 23K256-E/ST, 23K640-E/ST, 23A256-I/ST catalog part numbers (CPN) |
| 23K640T-I/ST | Microchip | Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material 23K640T-I/ST |
| 23A256-I/ST | Microchip | E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part |
| 23A256-I/ST | Microchip | 23K256-E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part numbers |
| 23A256T-I/ST | Microchip | 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, |
| 23A640-I/ST | Microchip | E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part |
| 23A640-I/ST | Microchip | 23K256-E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part numbers |
| 23A640T-I/ST | Microchip | I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256- |
| 23A640T-I/ST | Microchip | 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, |
| 23K256-E/ST | Microchip | 23K256-E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part numbers |
| 23K256-I/ST | Microchip | additional bond wire material 23K640T-I/ST, 23K256-I/ST, 23K640-I/ST, |
| 23K256-I/ST | Microchip | I/ST, 23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T- |
| 23K256T-E/ST | Microchip | I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256- |
| 23K256T-E/ST | Microchip | 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, |
| 23K256T-I/ST | Microchip | I/ST, 23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T- |
| 23K256T-I/ST | Microchip | 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, |
| 23K640-E/ST | Microchip | 23K256-E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part numbers |
| 23K640-E/ST | Microchip | E/ST, 23K640-E/ST, 23A256-I/ST, 23A640-I/ST catalog part |
| 23K640-I/ST | Microchip | additional bond wire material 23K640T-I/ST, 23K256-I/ST, 23K640-I/ST, |
| 23K640-I/ST | Microchip | I/ST, 23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T- |
| 23K640T-E/ST | Microchip | I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256- |
| 23K640T-E/ST | Microchip | 23K256T-I/ST, 23A256T-I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, |
| 23K640T-I/ST | Microchip | additional bond wire material 23K640T-I/ST, 23K256-I/ST, 23K640-I/ST, |
| 125C | Microchip | Electrical test pre and post stress at 85C and 125C |
| 125C | Microchip | 125C temp. |
| 125C | Microchip | Electrical test pre and post stress at +25C, 85C and 125C |
| 23A256T- | Microchip | I/ST, 23K256-I/ST, 23K640-I/ST, 23K256T-I/ST, 23A256T- |
| 23K256- | Microchip | I/ST, 23A640T-I/ST, 23K256T-E/ST, 23K640T-E/ST, 23K256- |
| 23K640T- | Microchip | (CuPdAu) as an additional bond wire material 23K640T- |
| 260C | Microchip | MSL 1 @ 260C |
| 4.4mm | Microchip | numbers (CPN) available in 8L TSSOP (4.4mm) package at |
| 4.4mm | Microchip | (CPN) available in 8L TSSOP (4.4mm) package at MMT assembly site. |
| 85C | Microchip | Electrical test pre and post stress at 85C and 125C |
| 85C | Microchip | Electrical test pre and post stress at +25C, 85C and 125C |
| 85C | Microchip | Electrical test pre and post stress at +25C, 85C and |
| B100 | Microchip | Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5 |
| B108 | Microchip | Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5 |
| BD-004371-01 | Microchip | BD Number BD-004371-01 |
| C7025 | Microchip | Material C7025 |
| CDF-AEC-Q100-001 | Microchip | Wire Bond Shear - WBS CDF-AEC-Q100-001 5 0 1 5 5 30 bonds from a min. 5 devices. |
| G600V | Microchip | MC Part Number G600V |
| JESD22 | Microchip | Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 5 |
| JESD22-A103. | Microchip | JESD22-A103. +175 C for 504 hours or 150°C for 1008 |
| JESD22-A104. | Microchip | Temp Cycle JESD22-A104. -65°C to +150°C for 500 cycles. |
| JESD22-A110. | Microchip | HAST JESD22-A110. +130°C/85% RH for 96 hours or |
| JESD22-A113. | Microchip | JESD22-A113. +150°C Bake for 24 hours, moisture |
| Jedec-STD-020E | Microchip | reflow temperature per Jedec-STD-020E for package |
| MFOL-04FAZG527 | Microchip | PCN #: MFOL-04FAZG527 |
| QMI519 | Microchip | Die Attach Part Number QMI519 |
| TK0017C5XD00 | Microchip | MP Code (MPC) TK0017C5XD00 |