PackageMCLP EP
MountingSurface Mount
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Technical Specifications
Mini-Circuits LEE-9+ technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | MCLP |
| Package/Case | MCLP EP |
| Lead Shape | No Lead |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 0.89 |
| Package Weight (g) | 0.02 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Manufacturer Type | Monolithic Amplifier |
| Number of Channels per Chip | 1 |
| Minimum Operating Frequency | 0MHz |
| Typical Output Power Range | 4 to 10dBm |
| Maximum Operating Frequency | 8000MHz |
| Typical Power Gain | 7.7@8000MHzdB |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 15542 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Mini-Circuits LEE-9+ Datasheet
Download the complete datasheet for Mini-Circuits LEE-9+ to view detailed technical specifications.
No datasheet is available for this part.