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Technical Specifications
NXP 2692/BYA technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
FPAK
Package/Case
FPAK
Package Description
Flat Package
Lead Shape
Flat
Pin Count
52
PCB
52
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP 2692/BYA Datasheet
Download the complete datasheet for NXP 2692/BYA to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.