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Technical Specifications
NXP 82S105/BXA technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Material
Ceramic
Mounting
Through Hole
Compliance
Cage Code
H1R01
HTS Code
8542390001
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
NXP 82S105/BXA Datasheet
Download the complete datasheet for NXP 82S105/BXA to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.