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Technical Specifications
NXP 82S105/BYA technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | FPAK |
| Package/Case | CFPAK |
| Package Description | Ceramic Flat Package |
| Lead Shape | Flat |
| Pin Count | 28 |
| PCB | 28 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
NXP 82S105/BYA Datasheet
Download the complete datasheet for NXP 82S105/BYA to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.