Wireless combo SoC integrates dual-band 2.4 GHz and 5 GHz Wi-Fi 5 with Bluetooth 5.2 in a single chip. The Wi-Fi subsystem supports IEEE 802.11ac Wave 2 1x1 operation with data rates up to MCS9 at 433 Mbit/s and 20 MHz, 40 MHz, or 80 MHz channel bandwidths. Host connectivity is provided through SDIO 3.0 for Wi-Fi and high-speed UART or SDIO 3.0 options for Bluetooth. Package options include a 68-pin 8 mm by 8 mm QFN with wettable flanks and an 83-bump 4.6 mm by 4.2 mm eWLP. Extended and industrial operating temperature grades support -30 °C to 85 °C and -40 °C to 85 °C operation.
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| Wireless standard | IEEE 802.11ac/n/a/g/b |
| Wi-Fi generation | Wi-Fi 5 |
| Wi-Fi band | 2.4; 5GHz |
| Wi-Fi MIMO configuration | 1x1 |
| Maximum Wi-Fi data rate | 433Mbit/s |
| Maximum modulation/coding scheme | MCS9 |
| Channel bandwidth | 20; 40; 80MHz |
| Bluetooth version | 5.2 |
| Bluetooth modes | Bluetooth Classic; Bluetooth Low Energy |
| Wi-Fi host interface | SDIO 3.0 |
| Bluetooth host interface | UART; SDIO 3.0 |
| Audio interface | PCM |
| Security features | TKIP; AES; WAPI; WPA3 |
| Supply voltages | 2.2; 1.8; 1.1V |
| Extended operating temperature | -30 to 85°C |
| Industrial operating temperature | -40 to 85°C |
| QFN package | 68-pin 8 x 8 mm QFN with wettable flanks |
| eWLP package | 83-bump 4.6 x 4.2 mm eWLP |
| GPIO count | Up to 21 |
| Antenna configurations | 2-antenna separate Wi-Fi/Bluetooth paths; 1-antenna shared path |
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