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Technical Specifications
NXP ASC8851AETE technical specifications.
General
Package/Case
TFBGA
Contact Plating
Copper, Tin, Silver
Core Architecture
ARM
Interface
SPI, USB, Ethernet, IrDA, MMC, SD, UART, USART, EBI/EMI
Lead Free
Lead Free
Mount
Surface Mount
Package Quantity
126
Packaging
Tray
Radiation Hardening
No
Compliance
RoHS
Compliant
Datasheet
NXP ASC8851AETE Datasheet
Download the complete datasheet for NXP ASC8851AETE to view detailed technical specifications.
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