NXP ASC8851AETE technical specifications.
| Package/Case | TFBGA |
| Contact Plating | Copper, Tin, Silver |
| Core Architecture | ARM |
| Interface | SPI, USB, Ethernet, IrDA, MMC, SD, UART, USART, EBI/EMI |
| Lead Free | Lead Free |
| Mount | Surface Mount |
| Package Quantity | 126 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS | Compliant |
Download the complete datasheet for NXP ASC8851AETE to view detailed technical specifications.
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