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NXP BAP70-05,215 technical specifications.
| Package/Case | TO-236AB |
| Contact Plating | Tin |
| Forward Current | 100mA |
| Max Current Rating | 100mA |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 250mW |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 250mW |
| Radiation Hardening | No |
| Reverse Voltage | 50V |
| Reverse Voltage (DC) | 50V |
| RoHS Compliant | Yes |
| RoHS | Compliant |
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